Principal Process Engineer, PCBA (IE)
03.05.2025
Singapur - Singapur Vertrieb / Technischer Support / Projektierung Produktion / Fertigung Vollzeit Präsenzarbeitsplatz
You want to make your ideas reality …
….and extend your limits at the same time?
Then you've come to the right place! We can offer you plenty of space for your ideas, excellent development possibilities and exciting challenges.
In automotive production, water treatment plants or chemical systems - around the world, electronic sensors and automation components by Pepperl+Fuchs guarantee smooth and safe operations. We know that dedicated and highly motivated employees are crucial to our success. As we want to continue growing, we hope to find, as soon as possible, for the following position in our subsidiary in Singapore:
Principal Process Engineer, PCBA (IE)
Role Purpose:
As a Subject Matter Expert in this area, the successful person will be responsible for the following:
- Industrialize Printed Circuit Board Assemblies (PCBAs) starting from concept, develop, prototype, pilot run and release to mass production in a New Product Introduction (NPI) environment
- Achieve optimum manufacturing by Design for Manufacturing / Assembly (DFM / DFA) inputs, review of components and material specifications, develop technical processes and tools to support industrialization of PCBAs and establish BoM structure
- Lead improvement projects of Industrial Engineering (IE) and participate as a member in Technology Development (TD) projects
- Support strategic ExpressOPS (Operations) initiative by providing express delivery of new PCBAs samples for new product innovation
Role Responsibilities:
- Ensure manufacturing feasibility study is completed before acceptance of PCBAs for industrialization
- Provide R&D with DFM / DFA inputs, review component specifications and PCB layout to ensure PCBA are manufacturable with sustainable good quality by:
- Participate actively in Risk Assessment (DFMEA & PFMEA) and lead Design of Experiments (DOE)
- Review, develop and setup BoM and product structure for new PCBA
- Provide PCBA manufacturing expertise to Business Unit and Production to meet time to market, quality and cost
- Collaborate with R&D Department to ensure industrialized PCBAs are passing through relevant laboratory and certification tests through development and implementation of quality acceptance methods for samples and prototypes
- Conceptualize, develop machines and fixtures, release production processes and parameters in Manufacturing Technologies (SMT / THT):
- Develop work instructions and methods for new PCBA
- Verify new component solderability, process window, zero point, and pad design
- Develop machine programs and qualifying new process parameters for various types of machines in SMT
- Troubleshoot production processes during actual build to achieve good quality for customer
- Responsible for executing New Technology and Improvement Projects:
- Testing and implementing of new material, new tools and new machines (FAT/SAT) with Technology Development and R&D departments in Technology Project Work Packages
- Participate & implement Technology Work Packages at SEA regional level
- Analyze data, provide solutions for productivity improvement & structured problem solving
- Deliver PCBA NPI under new ExpressOPS initiatives:
- Industrialize new PCBAs and transfer current PCBAs between locations according to company initiatives Product Engineering Process (PEP) and Production to Production (PTP)
- Responsible as a technical lead of End-to-End prototyping needs of PCBA
Role Requirements:
- Bachelor’s Degree in Electronics / Mechatronics Engineering or equivalent education. A Master’s Degree or PhD in PCBA Process development is an added advantage
- 10-15 years of industry experience, of which a minimum of 8 years of hands-on experience in industrialization and development of SMT and Printed Circuit Board Assembly during product development phase
- Industry experience and hands-on in the following SMT & Soldering technologies and setting up machine programs (Pick & Place, Stencil Development, Solder Paste Printing, Solder Paste Inspection, Reflow Soldering Profile Development, Glue Jetting, V-groove and Router De-paneling, Wave/Selective/Manual/Reflow Soldering)
- Knowledge in DOE, SPC, APQP, DFSS, and using SPC to determine the interrelations of process parameters and processes results
- Knowledge and hands-on expertise in Minitab, JMP or QS-stat software for process development, FMEA and Control plans is an advantage
- Knowledge in DFM / DFA for SMT PCBA and able to support R&D designer to design the PCBA to suit our current SMT production setup
- Possess in-depth knowledge of industrial standards (IPC, J-STD, ISO, others) & practical knowledge of design, manufacturing process, common defect (e.g. design, materials, process-related) & how to troubleshoot them from the early (design) until the late (mass production) stages for the assigned technologies
- Proficient in English for both verbal and written communication
- Able to work independently as well as in a team
- Self-motivated with great initiative and ability to work well under pressure
Have we piqued your interest?
Then we would like to meet you. Please send your application online and we look forward to your application!
Benny Tan
Haben Sie Fragen?
Ich helfe Ihnen gerne weiter.
+65 6779 9091 2195
khtan@sg.pepperl-fuchs.com
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Benny Tan
Haben Sie Fragen, dann schreiben Sie mir eine <a href="<a href="mailto:khtan@sg.pepperl-fuchs.com">khtan@sg.pepperl-fuchs.com</a>">E-Mail</a>. Ich helfe Ihnen gerne weiter.
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Tel: +65 6779 9091 2195
